What about domestic semiconductors from design, manufacturing, packaging, testing, equipment, and materials? (II)

Increasing self-sufficiency is imminent, and the strategy of big countries promotes industrial development:

The domestic semiconductor market is close to one-third of the world, but the domestic semiconductor self-sufficiency rate is very low, especially the core chip is extremely lacking, and the domestic market share is almost zero. The chip is related to national security, and localization is imminent. In 2014, the National Outline of the Development of Integrated Circuit Industry promoted the research and development of new technologies in the semiconductor industry to the national strategic level. The first phase of the investment of the big fund has achieved remarkable results, inciting local industrial funds to reach 500 billion yuan. At present, the fundraising of the second phase of the big fund has started, and the amount of funds raised will exceed one period, which will promote the development of the domestic semiconductor industry.

The rise of packaging design and measurement in the mainland, the key breakthroughs in materials and equipment:

After years of development, the domestic semiconductor ecology has gradually been built, and the development of the design, manufacturing, and packaging industry has become increasingly balanced. Design industry: Although the acquisition is limited, but the independent development is rapid, and the group is booming, Haisi Spreadtrum enters the top ten in the world. Manufacturing: The wafer manufacturing industry moved to the mainland, and the capacity of the mainland 12-inch wafer fab broke out. In terms of foundry, although it still takes a long time to catch up with international giants, SMIC's 28nm process has broken through, 14nm speeds up research and development; storage, Yangtze River Storage, Jinhua Integration, Hefei Changxin three storage projects steadily Advance. Sealing and testing industry: China's top three test and test companies entered the first echelon, preemptively layout advanced packaging. Equipment: The sales of domestic semiconductor equipment grew rapidly and steadily. A variety of products achieved breakthroughs from scratch, and the fire of the stars waited for the original. Materials: Domestic manufacturers have achieved initial success in small-size silicon wafers, photoresists, CMP materials, sputtering targets, etc. Localization of large-size silicon wafers is just around the corner.