Chip capacitor production process

The manufacturing process of chip capacitors is complicated and involves many steps, and it is difficult for a professional to understand the production process. Today, CBB capacitor manufacturers will explain in detail the production process of chip capacitors.

1. Mixing: The ceramic powder is mixed with a binder and a solvent to create a slurry, which makes it easy to mix materials.

2. Tape Casting: Pour the slurry into a conveyor belt in a dry box and dry the ceramic tape. Then cut into square blocks called tables. And the thickness of the thin plate determines the rated voltage of the capacitor.

3. Screen printing and superposition: The electrode ink is composed of a metal powder mixed solvent and a ceramic material to form an electrode ink. The electrodes are now printed on the ceramic table using a screen printing process.

4. Texture: SMD capacitor pressure is applied to the stack to fuse all the individual layers, which creates a monolithic structure. This is called a patch.

5. Cutting: Cut all individual chip capacitors into patches. This part is now in the so-called "green" state.

6. Shooting: The parts are slowly moving in the kiln to launch and conveyor. The temperature profile of the chip capacitor is very important.

7. Terminal: The terminal provides the first layer of electrical and mechanically connected capacitors. The metal powder mixed solvent and glass frit create a stop ink. The capacitor for each terminal is then inked and the parts are fired in the kiln.

8. Plating: Using an electroplating process, the termination is a layer of nickel and then a layer of tin. Nickel is terminated between a barrier layer and tinned. Tin is used to prevent nickel from oxidizing.