What are the points of attention when constructing a chip-shaped multilayer ceramic capacitor?

1.Unlike the lead components, the chip components are susceptible to bending stress because they are directly attached to the substrate. And they are more sensitive to mechanical and thermal stress than lead components. Excessively high fillet heights increase this type of stress and cause component damage. Therefore, when designing the substrate, please consider the layout and size of the pad to avoid high solder fillet height.

2.There is a possibility of capacitor cracking due to thermal expansion/contraction of the printed circuit board, because the material and structure of the printed circuit board are different, resulting in different stresses on the patch. When the difference in thermal expansion coefficient between the board and the capacitor used for mounting is large, the patch may be broken due to thermal expansion and contraction. When the capacitor is mounted on a fluororesin circuit board or a single-layer glass epoxy circuit board, the chip may be broken for the same reason.